Development trend of high performance signal connector

Development trend of high performance signal connector

2019-02-01 15:03:28

      

High-speed transmission refers to the modern computer, information technology and network technology requirements of the transmission of the time scale rate up to megahertz band, pulse time up to sub-millisecond, so the requirement for high-speed transmission of electronic signals connector (connector).


Large current is also an important development direction of many electronic connectors. Although short and thin, energy saving low consumption is the effort direction of consumer electronics, however, the following two aspects: decision in quite a number of applications, the power supply to the evolution of large current direction, our common computer CPU as an example to show the reasons: first, the computer performance, increase in the number for the CPU speed in the ascension, required by the transistor, therefore power consumption rise, in the case of constant voltage, increases with the current; Second, with the progress of semiconductor technology, the working voltage of the transistor gradually decreases, which is conducive to reducing power consumption. However, its physical characteristics determine that the proportion of power consumption reduction is less than the voltage. Therefore, the increase of current is also an important index to test the development of high performance of electronic connectors.

The resistance to signal interference and shielding, when the data transmission speed increases, the impact of capacitance and impedance is also more obvious. Signals at one terminal can cross - talk adjacent terminals and affect signal integrity. In addition, the grounding capacitance reduces the impedance of the high-speed signal and attenuates the signal. In the new connector design, each signal transmission terminal is separated from each other. Differential signal pairs do this well because each pair has a ground pin on one side to reduce crosstalk. The first layer is usually an open area to separate the adjacent grounding terminals. The next level is the line - to - line grounding shield. The top level application will include a metal grounding structure around each signal terminal. Such metal shielding provides the best combination of data transmission speed and signal integrity.


Reliability and environmental protection in extreme environment. In the modern high-tech industry, there are many connectors used in extreme environmental conditions, such as ultra-high temperature, low temperature, vibration, hot and humid environment, corrosive environment, electronic connectors can be used effectively and normally, which makes the connector in the selection of raw materials, structural design, processing technology has higher requirements. New high-temperature resistant materials, new electroplating and coating processes, and more resilient alloy materials make future connectors more adaptable to harsh environments.

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